Founded in 1989, Sundance Technologies is strategically positioned to design and manufacture a comprehensive range of highly competitive engineered products for the high performance embedded signal processing market. The company's products are designed in a modular organization, easy to upgrade, and highly scalable. The processing chips include TI's TMS320C6x series DSP signal processors and Xilinx FPGA devices. Many product modules have been implemented for the second generation. Even three generations of upgrades and upgrades continue to be optimized to meet user performance and application needs.
In July 2015, Sundance realized the system combination of Xilinx ArTIx-7 series FPGA board module and its PC/104 expansion backplane. In early 2016, it launched the EMC2-Z7030 PCIe/104 SBC system combination board and provided SDSoC integrated development. Environment, this modular product model has been welcomed by engineers. Therefore, we are introducing Sundance's new EMC2-KU35 combination system development board.
Figure 1 Sundance Introduces EMC2-KU35 Combination System Board
The Sundance EMC2-KU35 combo system board consists of two parts: the Trenz Electronic TE0841 FPGA module and the EMC2-DP OneBank expansion board developed by Sundance.
Figure 2 Trenz Electronic TE0841 Kintex UltraScale FPGA Module
The TE0841 FPGA Module is an industrial-grade system module that integrates the Xilinx Kintex UltraScale KU35/KU40 signal FPGA device with DDR4 SDRAM and FLASH memory. The powerful power management design meets all voltage requirements on the board, providing a comprehensive I/ O expansion interface, small size, cost-effective is very competitive:
Integrated Kintex UltraScale KU35/KU40 in A784 package
Storage: 2x16-bit DDR4; SPI Boot Flash up to 256MB
Size: 40x50mm
3mm fixing hole
The board-to-board connector includes: user I/O interface, serial transceiver interface, GT clock input interface
Clock resources: Si5338-4 PLL output; GT and PL clock; 200MHz LVDS crystal
The EMC2-DP OneBank expansion board is a PCIe/104 standard expansion board developed by Sundance. It is the latest design and long-term maintenance and upgrade of the backplane system. The board size is 90mmx96mm and the standard board-to-board direct connector is used. This allows it to support an unlimited number of core processing modules to interface with it.
Sundance's technical director said that through rigorous testing, the EMC2-KU35 combo system board with the Xilinx Kintex UltraScale KU035 FPGA delivers superior performance over other company systems to meet the demands of higher system computing performance applications. At the same time, this modular system organization design allows Sundance and engineers to quickly integrate Xilinx's latest All Programmable devices.
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