The difference in chip radiated power level
Take the chip of Xiamen Sanan as an example, S-23BBMUP-C*******, the chip size is 23X10mil, this core has 4 radiation power levels (@20mA), the higher the radiation power, the lamp beads made The brighter it is.
D24 radiation power 26-28mW
D25 radiation power 28-30mW
D26 radiation power 30-33mW
D27 Radiated power 33-36mW
The radiation power of D24 and D27 is 8mW, that is to say, the same size of the chip, the brightness of the lamp bead is different, there is a lot of difference, you need to know the radiation power level of the chip.
The difference between the lamp holder material
At present, there are aluminum brackets, brass brackets, and copper brackets on the market. The aluminum brackets are the cheapest, and the copper brackets are the most expensive, and the price difference is ten times.
Even for the copper bracket, the price of silver plating is also high or low. The market is generally called a good bracket, and most of it is made of brass silver.
Chip size difference
Usually the reported chip size is in mil. If there is no high-power measuring microscope, it is generally difficult to distinguish, and the larger the chip, the brighter it is.
We can compare the chip size by calculating the chip area, such as 23X10, the chip area is 230 square mil, it is a good way to distinguish the chip size with the chip area.
The difference between wire bonding materials
The chip and the bracket are connected by gold wire welding method. Currently, there are two kinds of alloy wire and pure gold wire on the market, and the pure gold wire is the best.
The gold wire is divided into 0.7, 0.9, 1.0, 1.2, etc. according to the thickness. The thicker the gold wire, the lower the heat group and the longer the life. All the materials and diameters of the gold wire are asked.
Phosphor difference
The white light bulb is made of a blue chip and a yellow phosphor, and the phosphor is mainly divided into an aluminate and a silicate.
The performance of aluminate is better than that of silicate. The most representative of aluminate is YAG. The performance of YAG is stable, the light decay is low, the chemical stability of silicate itself is poor, but the brightness is higher than that of YAG. Don't be fooled by the so-called high brightness, this is a big problem.
Glue difference
The phosphor is to be stirred on the chip after being stirred with the glue. The quality of the glue affects the light decay and color drift. The poor glue time will be yellow, the light decay will increase, and the good glue is the jelly glue.
Color separation, partial pressure and spectroscopic specifications
Color separation:
Is the color temperature bin, such as 3200K-3350K for a file, the regular packaging factory will provide the color temperature of the BIN code, the smaller the color temperature file, the better the color temperature, the color temperature is consistent.
Partial pressure:
It is the voltage division of the chip, such as 3.0V-3.15V. For the connection mode of the light source in series and parallel, the voltage binning is controlled within 0.15V, so that the current distribution of the light source is uniform, which is beneficial to improve the life of the light source.
Spectroscopic:
It is the brightness of the lamp bead, there is a lumen binning or a light intensity bin. For lighting sources, it is best to use lumen binning. It is recommended to purchase LEDs, or based on light efficiency, high-efficiency products will save energy and have a long life.
LED chip electrode map
Different chip manufacturers, LED quality is also different, LED suppliers will confess that their LED lamp beads are packaged with brand chips, after white LED packaging, it is impossible to judge the chip manufacturer from the appearance, need to strip the chip in high power microscope Under test.
The patterns of the conductive electrodes arranged on the surface of different LED chips are different (as shown below):
This electrode pattern is also called the chip electrode map. By examining the chip electrode map, it is possible to verify the chip supplier of the LED supply trademark, because the electrode maps of different chip manufacturers are different.
Through this method, it is possible to verify the manufacturer of the chip, and the LED products of the brand chip package are guaranteed.
Mastering the above eight LED lamp bead evaluation methods, you can guarantee the most basic quality assurance of the purchased LED products.
In the LED lamp bead supply market, the most problem is the high lumens, the chip size is not met, the counterfeit brand chip, the iron bracket is used to impersonate the copper bracket, etc. These problems require the above knowledge to be identified, and the professional LED test can also be made. Taobao shop provides testing.
Take the chip of Xiamen Sanan as an example, S-23BBMUP-C*******, the chip size is 23X10mil, this core has 4 radiation power levels (@20mA), the higher the radiation power, the lamp beads made The brighter it is.
D24 radiation power 26-28mW
D25 radiation power 28-30mW
D26 radiation power 30-33mW
D27 Radiated power 33-36mW
The radiation power of D24 and D27 is 8mW, that is to say, the same size of the chip, the brightness of the lamp bead is different, there is a lot of difference, you need to know the radiation power level of the chip.
The difference between the lamp holder material
At present, there are aluminum brackets, brass brackets, and copper brackets on the market. The aluminum brackets are the cheapest, and the copper brackets are the most expensive, and the price difference is ten times.
Even for the copper bracket, the price of silver plating is also high or low. The market is generally called a good bracket, and most of it is made of brass silver.
Chip size difference
Usually the reported chip size is in mil. If there is no high-power measuring microscope, it is generally difficult to distinguish, and the larger the chip, the brighter it is.
We can compare the chip size by calculating the chip area, such as 23X10, the chip area is 230 square mil, it is a good way to distinguish the chip size with the chip area.
The difference between wire bonding materials
The chip and the bracket are connected by gold wire welding method. Currently, there are two kinds of alloy wire and pure gold wire on the market, and the pure gold wire is the best.
The gold wire is divided into 0.7, 0.9, 1.0, 1.2, etc. according to the thickness. The thicker the gold wire, the lower the heat group and the longer the life. All the materials and diameters of the gold wire are asked.
Phosphor difference
The white light bulb is made of a blue chip and a yellow phosphor, and the phosphor is mainly divided into an aluminate and a silicate.
The performance of aluminate is better than that of silicate. The most representative of aluminate is YAG. The performance of YAG is stable, the light decay is low, the chemical stability of silicate itself is poor, but the brightness is higher than that of YAG. Don't be fooled by the so-called high brightness, this is a big problem.
Glue difference
The phosphor is to be stirred on the chip after being stirred with the glue. The quality of the glue affects the light decay and color drift. The poor glue time will be yellow, the light decay will increase, and the good glue is the jelly glue.
Color separation, partial pressure and spectroscopic specifications
Color separation:
Is the color temperature bin, such as 3200K-3350K for a file, the regular packaging factory will provide the color temperature of the BIN code, the smaller the color temperature file, the better the color temperature, the color temperature is consistent.
Partial pressure:
It is the voltage division of the chip, such as 3.0V-3.15V. For the connection mode of the light source in series and parallel, the voltage binning is controlled within 0.15V, so that the current distribution of the light source is uniform, which is beneficial to improve the life of the light source.
Spectroscopic:
It is the brightness of the lamp bead, there is a lumen binning or a light intensity bin. For lighting sources, it is best to use lumen binning. It is recommended to purchase LEDs, or based on light efficiency, high-efficiency products will save energy and have a long life.
LED chip electrode map
Different chip manufacturers, LED quality is also different, LED suppliers will confess that their LED lamp beads are packaged with brand chips, after white LED packaging, it is impossible to judge the chip manufacturer from the appearance, need to strip the chip in high power microscope Under test.
The patterns of the conductive electrodes arranged on the surface of different LED chips are different (as shown below):
This electrode pattern is also called the chip electrode map. By examining the chip electrode map, it is possible to verify the chip supplier of the LED supply trademark, because the electrode maps of different chip manufacturers are different.
Through this method, it is possible to verify the manufacturer of the chip, and the LED products of the brand chip package are guaranteed.
Mastering the above eight LED lamp bead evaluation methods, you can guarantee the most basic quality assurance of the purchased LED products.
In the LED lamp bead supply market, the most problem is the high lumens, the chip size is not met, the counterfeit brand chip, the iron bracket is used to impersonate the copper bracket, etc. These problems require the above knowledge to be identified, and the professional LED test can also be made. Taobao shop provides testing.
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