SEMICON Taiwan2011 will be launched on the 7th, and 3DIC is still the focus of this exhibition. Tang Heming, general manager and research and development officer of the Sun Moonlight Group, which promotes 2.5D and 3DIC technologies, said that the semiconductor supply chain has shown signs of activity in the past one year, and the resources for related research and development have increased significantly among major manufacturers. In order to define the interface standard between memory and logic IC, Wide-I/O Memorybus is also expected to be established before the end of the year. He expects 2013 to be the first year of 3DIC production.
According to 2.5D and 3DIC, Tang Heming said that the recent semiconductor supply chain has accelerated its investment in R&D. Many manufacturers have joined the R&D supply chain, including wafer fabs and packaging and testing plants. The cost of R&D at 3DIC is higher than that of 2010. Increase a lot, this is a good thing to develop 3D industry chain. He predicted that 3DIC should be expected to see a large amount of production in 2013 and should be regarded as the first year of mass production of 3DIC.
Tang Heming admitted frankly that at present, 3DIC still has many difficulties and challenges to be solved. Roller crusher prices, such as IC design, foundry, packaging and testing, systems, and other manufacturers need to be strengthened and integrated; for example, in terms of testing It is also crucial for companies to increase the yield of good bare die Known GoodDie tests. The entire semiconductor supply chain must solve these problems together.
For the packaging and testing industry, there has been a major breakthrough in the cooperation between manufacturers in the previous and the latter stages, namely the development of the Wide-I/O Memorybus. Tang Heming said that in the 3D era, system-level packaging (SiP) is put to the fore, and ICs with different properties such as logic indirect heat transfer dryers are stacked on the carrier board. IC and memory, how these two heterogeneous ICs communicate with each other, which must define the standard, and then promote Wide-I/O Memorybus. This standard has been jointly developed by various semiconductor companies such as Intel, Qualcomm, Qualcomm, Elpida, Samsung Electronics, Sun Moonlight, etc. It is expected that the cement mill can be completed before the end of the year. Once the impact is broken, the standard is established for each production. It will be helpful to speed up the mass production of 3D packaging. It is worth noting that Sun Moonlight actively promoted the development of the standard and made Taiwan also play an important role in the formulation of major standards.
Tang Heming said that 3DIC and system-on-chip SoC technologies complement each other, and the integration of system functions through 3DIC will make ICs with higher density and efficiency, lower power consumption, and meet environmental protection requirements. The 3DIC application will be mainly based on mobile phones and tablet PCs, while the 2.5 DIC is due to the large die size, so the application side will start from notebooks and desktops. The company is actively integrating with the semiconductor industry supply chain and is expected to introduce 3DIC mass production in 2013. It will be used in high-end mobile phones, PCs, and medical doctors. ~.
The company has accumulated more than 30 years of experience in mining machinery, research and development of a number of sand-making machines, cement mill manufacturers, jaw crusher plant and other domestic advanced brands. To win the majority of customers consistent good product.
According to 2.5D and 3DIC, Tang Heming said that the recent semiconductor supply chain has accelerated its investment in R&D. Many manufacturers have joined the R&D supply chain, including wafer fabs and packaging and testing plants. The cost of R&D at 3DIC is higher than that of 2010. Increase a lot, this is a good thing to develop 3D industry chain. He predicted that 3DIC should be expected to see a large amount of production in 2013 and should be regarded as the first year of mass production of 3DIC.
Tang Heming admitted frankly that at present, 3DIC still has many difficulties and challenges to be solved. Roller crusher prices, such as IC design, foundry, packaging and testing, systems, and other manufacturers need to be strengthened and integrated; for example, in terms of testing It is also crucial for companies to increase the yield of good bare die Known GoodDie tests. The entire semiconductor supply chain must solve these problems together.
For the packaging and testing industry, there has been a major breakthrough in the cooperation between manufacturers in the previous and the latter stages, namely the development of the Wide-I/O Memorybus. Tang Heming said that in the 3D era, system-level packaging (SiP) is put to the fore, and ICs with different properties such as logic indirect heat transfer dryers are stacked on the carrier board. IC and memory, how these two heterogeneous ICs communicate with each other, which must define the standard, and then promote Wide-I/O Memorybus. This standard has been jointly developed by various semiconductor companies such as Intel, Qualcomm, Qualcomm, Elpida, Samsung Electronics, Sun Moonlight, etc. It is expected that the cement mill can be completed before the end of the year. Once the impact is broken, the standard is established for each production. It will be helpful to speed up the mass production of 3D packaging. It is worth noting that Sun Moonlight actively promoted the development of the standard and made Taiwan also play an important role in the formulation of major standards.
Tang Heming said that 3DIC and system-on-chip SoC technologies complement each other, and the integration of system functions through 3DIC will make ICs with higher density and efficiency, lower power consumption, and meet environmental protection requirements. The 3DIC application will be mainly based on mobile phones and tablet PCs, while the 2.5 DIC is due to the large die size, so the application side will start from notebooks and desktops. The company is actively integrating with the semiconductor industry supply chain and is expected to introduce 3DIC mass production in 2013. It will be used in high-end mobile phones, PCs, and medical doctors. ~.
The company has accumulated more than 30 years of experience in mining machinery, research and development of a number of sand-making machines, cement mill manufacturers, jaw crusher plant and other domestic advanced brands. To win the majority of customers consistent good product.
Wire Harness,Automotive Cnnectors Co., Ltd. , http://www.nswireharness.com