On September 6, the relevant media announced the results of the "Tenth China IC Design Company Survey." According to the survey, China's top IC design companies have adopted 28-nanometer cutting-edge technology to develop chips, and 9.2% of local fabless semiconductor companies have also adopted advanced 45-nanometer or lower technology for design and large-scale mass production.
The survey results also show that more and more local IC design companies use Taiwan's foundries to support their high-voltage, high-reliability, and highly-integrated product designs. Of the companies using foundry services, 63% will select Taiwan's foundries, compared to 57% in 2010. And 33.1% of the respondents believe that TSMC is the most suitable semiconductor foundry partner (30% in 2010). In addition, 18.9% and 15% of the surveyed companies respectively stated that SMIC and China Resources Shanghua in Mainland China are their most suitable foundry partners.
The Chinese IC design industry is experiencing rapid growth. According to a recent survey released by IHS iSuppli, the revenue of fabless semiconductor companies in China is expected to reach 10.7 billion U.S. dollars in 2015, more than double the 5.2 billion U.S. dollars in 2010.
Dr. Dai Weimin, Chairman and President of VeriSilicon Microelectronics (Shanghai) Co., Ltd., said: “The current global environment is very conducive to the rapid development of China’s semiconductor companies. The global semiconductor industry’s focus is shifting to China where production accounts for one third of the global market. The share of Chinese products in the world semiconductor market will continue to grow, and the support of the Chinese government will further promote the development of the industry."
"China IC Design Company Survey" shows that 57% of China's IC design is applied to consumer electronics products such as mobile phones and tablet computers. The main characteristics of the consumer electronics field are rapid innovation and fierce competition, and thus continue to promote the development of China's domestic IC design industry.
There are 9.2% of the surveyed companies that have mass-produced digital ICs using a process technology of 45nm or less. Analysts of EE Times believe that in the coming years, even though 65nm will continue to be the mainstream technology for digital IC design, more powerful Chinese chip design companies will adopt advanced 40nm and 28nm processes. Technology successfully developed IC.
Although 23.2% and 27.5% of the companies surveyed used 0.13-micron process technology in analog IC design and mixed-signal IC design respectively, the main process technologies in these two areas are still 0.18-micron and 0.35-micron process technologies.
The other major findings of the "China IC Design Company Survey" are as follows:
The major difficulties faced in cooperating with OEMs are the cost (59.8%) and the delivery cycle (55.9%), and the lack of production capacity is no longer a major difficulty this year (19.7%, 35% in 2010);
35.2% of the companies surveyed used IP cores authorized by semiconductor foundries, 26.1% were authorized by design service companies, and 25.4% were authorized by ARM;
The major challenges faced by respondents in the design process were to reduce design costs (69.7%), low-power design (54.2%) and shorten the design cycle (46.5%).
The survey results also show that more and more local IC design companies use Taiwan's foundries to support their high-voltage, high-reliability, and highly-integrated product designs. Of the companies using foundry services, 63% will select Taiwan's foundries, compared to 57% in 2010. And 33.1% of the respondents believe that TSMC is the most suitable semiconductor foundry partner (30% in 2010). In addition, 18.9% and 15% of the surveyed companies respectively stated that SMIC and China Resources Shanghua in Mainland China are their most suitable foundry partners.
The Chinese IC design industry is experiencing rapid growth. According to a recent survey released by IHS iSuppli, the revenue of fabless semiconductor companies in China is expected to reach 10.7 billion U.S. dollars in 2015, more than double the 5.2 billion U.S. dollars in 2010.
Dr. Dai Weimin, Chairman and President of VeriSilicon Microelectronics (Shanghai) Co., Ltd., said: “The current global environment is very conducive to the rapid development of China’s semiconductor companies. The global semiconductor industry’s focus is shifting to China where production accounts for one third of the global market. The share of Chinese products in the world semiconductor market will continue to grow, and the support of the Chinese government will further promote the development of the industry."
"China IC Design Company Survey" shows that 57% of China's IC design is applied to consumer electronics products such as mobile phones and tablet computers. The main characteristics of the consumer electronics field are rapid innovation and fierce competition, and thus continue to promote the development of China's domestic IC design industry.
There are 9.2% of the surveyed companies that have mass-produced digital ICs using a process technology of 45nm or less. Analysts of EE Times believe that in the coming years, even though 65nm will continue to be the mainstream technology for digital IC design, more powerful Chinese chip design companies will adopt advanced 40nm and 28nm processes. Technology successfully developed IC.
Although 23.2% and 27.5% of the companies surveyed used 0.13-micron process technology in analog IC design and mixed-signal IC design respectively, the main process technologies in these two areas are still 0.18-micron and 0.35-micron process technologies.
The other major findings of the "China IC Design Company Survey" are as follows:
The major difficulties faced in cooperating with OEMs are the cost (59.8%) and the delivery cycle (55.9%), and the lack of production capacity is no longer a major difficulty this year (19.7%, 35% in 2010);
35.2% of the companies surveyed used IP cores authorized by semiconductor foundries, 26.1% were authorized by design service companies, and 25.4% were authorized by ARM;
The major challenges faced by respondents in the design process were to reduce design costs (69.7%), low-power design (54.2%) and shorten the design cycle (46.5%).
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