A major progress in the miniaturization of electronic devices is the use of three-dimensional model interconnection technology 3D-MID to achieve high integration of electrical and mechanical performance. Quantitative production, flexible design and shorter production processes are the main advantages of this technology. At present, a new 3D-MD technology has been developed, this process is called laser direct line forming process LDS. It has only three processes: injection molding with organic metal plastics; laser activation of the component surface; and chemical plating to make the active area form circuit wiring.
LDS can make the processing accuracy of line width and spacing reach 20, and it is also an environmental protection technology. One is to place particles that can cause metal deposition on the surface of the plastic substrate; the second is to roughen the surface to enhance the adhesion between the coating and the substrate. The plastic used for laser activation is a kind of modified plastic containing organic metal complexes. Exciting; on the one hand, the organic metal complex releases metal particles on the one hand, and on the other hand, it breaks the polymer molecular chain and Roughen the surface. In this way, the surface of the modified plastic after the tongue can be metallized.
The organometallic compound should have the following characteristics: insulation; resistance to visible light; uniform distribution in the plastic matrix; release of metal particles after laser irradiation; high temperature resistance; low toxicity; cheap. Many organometallic compounds have been developed and synthesized with different plastics to form various modified plastics. Organometallic composites, inorganic fillers, polymers and other additives are mixed, melted at high temperature, and cooled to form an isotropically modified thermoplastic, which is then crushed to make particles suitable for injection molding machines.
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