After the invention of LED by Nick Holonyak Jr. in 1962, due to its long life and power saving characteristics, LED issues have become the focus of the world and have developed rapidly. From low-power warning lights to high-power illumination, high illumination brightness The thermal effect brought about with it. In order to solve the thermal effect problem, the packaging material is gradually changed from FR4 to MCPCB and then upgraded to ceramic material, because the ceramic material has a matching expansion coefficient, good thermal and chemical stability, and LED. It has excellent insulation and withstand voltage characteristics, so it is most suitable for heat dissipation of high-power LED lighting.
The traditional LED packaging process is to bond the LED chip on the heat-dissipating substrate, connect the wires through Wire Bonding or Flip Chip, and finally form the glue and mold ( Molding) and other methods of coating the LED chip to form the LED die, and finally fixing the die on the circuit board, and integrating the power, heat sink, lens (Lens) and reflector cup (reflector) constitutes a complete lighting module.
Figure 1: LED package schematic
Table 1: Comparison of various boards
In the lighting module, the heat received by the substrate and the circuit carrier is the most dense, so the substrate directly contacting the heat source uses ceramic as the material, and when the power is higher and the components are getting smaller, the ceramic Circuit boards are also being used in large numbers. As shown in Table 1, ceramic circuit carriers have more advantages than traditional circuit boards for LED lighting, and can be applied to LED lighting such as high power (HP), high voltage (HV) and alternating current (AC). Higher energy conversion rate or no need for power converters, so the integration of the two technologies can not only improve the stability of LED lighting, but also reduce the overall cost of the whole, making it easier to import into the home lighting market.
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